发明名称 WORKING METHOD FOR THIN FILM SHEET MATERIAL
摘要 PURPOSE:To form holes having a linearity with a high speed in a deep seated thin sheet materials in the direction of thickness, by irradiating an electron beam or a laser beam from one side in the state of stacking thin film sheet materials made of nonmetal for >=3 layers. CONSTITUTION:An electron beam or a laser beam is irradiated from one side on nonmetallic thin film sheet materials stacked for >=3 layers. Then, even though the hole thus formed in the first layer becomes off-grade because if its larger diameter, holes formed in the second layer and below become required ones having a prescribed diameter and linearity under a relatively wide range of working conditions. Moreover, when this working is made on metallic thin sheet materials, they are stacked for >=3 layers in the same way, but a plastic sheet is placed between each layer of material so that melted metallic materials may not seam and solidify to each other at the boundary. In this way, the piercing speed is increased several times as much as conventional methods and the range of working conditions is enlarged several times as much as before.
申请公布号 JPS5714484(A) 申请公布日期 1982.01.25
申请号 JP19800086593 申请日期 1980.06.27
申请人 发明人
分类号 B23K26/00;B23K15/00;B23K15/08;B23K26/38 主分类号 B23K26/00
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