| 摘要 |
PURPOSE:To improve the degree of integration by forming a structure, parts mounting surfaces thereof are two surfaces or more, by combining a plurality of substrates. CONSTITUTION:The ceramic substrates 10, 12 with I-shaped sections have the parts mounting surfaces 18, 20 and 22, 24 at the insides. An IC42 and resistors 44, 48 are each mounted onto the surfaces 20, 22 and wiring 46, 52 is wired, and projecting sections 28, 30 are mutually sealed and bonded by a bonding section 14. A capacity 36 is fitted onto the surface 18 and wiring 38 is wired and the surface 18 is coated with resin 40, and a resistor 50 is attached onto the surface 24 and the surface 24 and wiring 54 are coated with resin 56. According to this constitution, a large number of parts can be mounted keeping a device as it is small-sized, and the degree of integration is further improved. |
