PROCESS AND DEVICE FOR SOLDERING COMPONENTS TO A THICK-FILM SUBSTRATE,申请号EP19790200258-传众专利搜索

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发明名称	PROCESS AND DEVICE FOR SOLDERING COMPONENTS TO A THICK-FILM SUBSTRATE
摘要
申请公布号	EP0005883(B1)	申请公布日期	1982.01.20
申请号	EP19790200258	申请日期	1979.05.25
申请人	N.V. PHILIPS' GLOEILAMPENFABRIEKEN	发明人	VAN DER PUT, HENRICUS CORNELIS ADRIANUS
分类号	B21H1/18;B23K1/00;B23K1/08;H05K1/03;H05K1/09;H05K3/34;(IPC1-7):01L49/02;05K3/34;23K1/08	主分类号	B21H1/18
代理机构		代理人
主权项
地址

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