发明名称 |
Semiconductor device. |
摘要 |
A semiconductor device includes p- and n-type semiconductor layers formed on an insulating substrate and an n-type interconnection layer formed to be electrically coupled with said n-type semiconductor layer. The n-type interconnection layer is formed in contact with the p-type semiconductor layer and is set at such a potential as to apply a reverse voltage across the p-n junction between the n-type interconnection layer and p-type semiconductor layer, so as to electrically isolate the n-type interconnection layer from the p-type semiconductor layer. |
申请公布号 |
EP0043930(A2) |
申请公布日期 |
1982.01.20 |
申请号 |
EP19810104661 |
申请日期 |
1981.06.16 |
申请人 |
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA |
发明人 |
EGAWA, HIDEHARU;NISHI, YOSHIO;MAEGUCHI, KENJI |
分类号 |
H01L23/52;H01L21/3205;H01L23/522;H01L23/532;H01L27/12;(IPC1-7):01L23/48;01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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