发明名称 Process of coating the surface of a board
摘要 A process of insulatingly coating a front and a back surface of a printed circuit board is disclosed. A vessel has a large top opening for receiving coating liquid therein and has a plurality of small apertures formed in the bottom. The vessel is immersed into a pool of coating liquid contained in a reservoir for injection of coating liquid into the vessel. The vessel is pulled upward from the reservoir before a printed circuit board reaches the location of the vessel, whereby a coating liquid flows down through the plurality of apertures in the vessel as series of continuous thin streams in the form of strings. A printed circuit board disposed at an angle is fed through the shower thus formed. After passing through the shower, the board is pivotally driven to present a surface which has previously been facing downward upward, and the board is again fed in an inclined position through the shower. The coating liquid on the front and the back surface is allowed to be drained off the board, which is then fed to a drying stage where an air stream is directed upward toward the board from the downside thereof, and the board is angularly driven about a horizontal axis.
申请公布号 US4600601(A) 申请公布日期 1986.07.15
申请号 US19850744726 申请日期 1985.06.14
申请人 AISIN SEIKI KABUSHIKIKAISHA 发明人 TAMURA, KAZUYOSHI
分类号 H05K3/28;B05C5/00;B05D1/30;B05D7/00;H01B19/04;H05K3/00;(IPC1-7):B05D5/12 主分类号 H05K3/28
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