| 摘要 |
PURPOSE:To provide a high-quality and highly reliable electronic component by performing high-density and highly accurate wire bonding. CONSTITUTION:First insulating resin 21 is sprayed mistily on a bonding area formed by connecting wiring electrodes provided on a substrate by fine lines or on a bonding area formed by connecting the wiring electrode provided on the substrate with an electrode on an electronic component chip 16 by fine lines. Then, the area is coated with second insulating resin 23. |
