| 摘要 |
PURPOSE:To prevent an interface section from exfoliation and improve humidity- resisting performance, in a resin mold type device, by forming on the level of mold section of a lead frame a coupling agent layer capable of improving interface joining performance. CONSTITUTION:In a device in which a pellet 3 is joined to a tap 2 of a lead frame 1 and closed by resin 10, on an inner lead section 8 to which a wire 9 is to be connected, such a substance as aluminum chelate compound is coated as a coupling agent layer 11 and baked, and in the case of providing a polyimide type resin layer 13 on the surface of the pellet 3 for preventing alpha rays, after piling such a mateial a nitride film 7 on other surfaces than an aluminum pad section 6, a coupling agent layer 12 is provided in the same manner to form a resin layer 13. It is possible, by doing so, to prevent deterioration of humidity-resisting performance due to exfoliation of interface between the inner lead 8 and the rewin 10, etc., and it is also possible to prevent coming in of water from surface of the pellet 3 even at the time when the resin 10 absorbed humidity to a certain extent. |
