| 摘要 |
<p>The invention is concerned with the problem of the package density which can be achieved using integrated circuit packages. An integrated circuit package (10) includes a plurality of contact pins (14) having a plurality of conductors (32, 34) thereon. In one embodiment, each pin (14) includes an insulating substrate (30) and a conductor (32, 34) on each of two opposing sides of the substrate (30). An external connector (42) for each pin (14) has two contacts (46, 48), one contact for engaging each of the two conductors (32, 34) on the pin (14). In other embodiments, each pin (114, 214) includes four conductors. An external connector (142, 242) for each pin (114, 214) has four contacts, one contact for engaging each of the four conductors on the pin (114, 214). </p> |
