发明名称 |
Cooling system for electronic device |
摘要 |
A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.
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申请公布号 |
US6487074(B1) |
申请公布日期 |
2002.11.26 |
申请号 |
US20010921796 |
申请日期 |
2001.08.02 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
KIMURA NAOKI;NIEKAWA JUN;MAEKAWA HIROAKI |
分类号 |
H05K7/20;G06F1/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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