发明名称 CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
摘要 <p>A circuit board including a conductor prefabricated so as to have a given pattern and a resin base material resulting from transfer of the conductor to a surface layer of thermosetting resin and hardening of the thermosetting resin, characterized in that the surface of the conductor and the surface of the resin base material constitute one plane. Further, there is provided a process for producing the circuit board.</p>
申请公布号 WO2008044308(A1) 申请公布日期 2008.04.17
申请号 WO2006JP320453 申请日期 2006.10.13
申请人 MANAC INC.;INAGAKI, HIROYASU;KAWANISHI, NORIYUKI 发明人 INAGAKI, HIROYASU;KAWANISHI, NORIYUKI
分类号 H05K3/20;H05K3/00 主分类号 H05K3/20
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