Die-stamped circuit board assembly for photoflash devices and method of making.

摘要

A circuit board assembly (23) and method of making wherein the assembly (23) includes a dielectric substrate (47), at least one radiation sensitive switch (45), and at least one conductive member (61) in electrical contact with the switch (45). Portions of the switch (45) and the conductive member (61) are die-stamped into the dielectric substrate (47) to achieve the contact without severing the switch material.