| 摘要 |
PURPOSE:To attain uniform bonding strength by improving the bonding between Si- containing inorganic insulating film and polyimide resin film, by using a coupling agent consisting of 0.01-50wt% organozirconium chelate compound and an organic solvent. CONSTITUTION:A coupling agent is prepared from 0.01-50wt% organozirconium chelate compound, such as tetrakisacetylacetonatozirconium or monobutoxytrisacetylacetonatozirconium, and a solvent dissolving said chelate compound or a dispersant forming a colloidal solution therewith, preferably a solvent such as benzene or toluene. When the amount of said chelate compound is below 0.01wt%, the bonding between Si substrate and polyimide resin film cannot be improved. When the amount is above 50wt%, the coupling agent coating becomes too thick to obtain uniform bond strength. |
