| 发明名称 |
DISPOSITIVO SEMICONDUTTORE DEL TIPO STAMPATO IN RESINA. |
| 摘要 |
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring. |
| 申请公布号 |
IT8123674(D0) |
申请公布日期 |
1981.08.28 |
| 申请号 |
IT19810023674 |
申请日期 |
1981.08.28 |
| 申请人 |
HITACHI LTD CHIYODA KU TOKYO GIAPPONE HITACHI MICROCOMPUTER ENGINEERING LTD KODAIRA SHI TOKYO GIAPPONE |
发明人 |
YUJI HARA;SATORU ITO;TATSURO TOYA |
| 分类号 |
H01L21/822;H01L21/31;H01L21/3205;H01L23/29;H01L23/31;H01L23/52;H01L23/58;H01L27/04;H01L29/40 |
主分类号 |
H01L21/822 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
