发明名称 Semiconductor device and method of manufacturing same
摘要 A semiconductor device includes a silicon substrate having an insulating layer with a window. A silicon layer is deposited on the insulating layer and on the silicon substrate surface in the window. This silicon layer has n-type and p-type conductive layer parts which adjoin each other within the window and which each serve as both a connection conductor and an electrode of an active zone of the device. Semiconductor devices in accordance with the invention feature very small surface areas, and are thus particularly suitable for high frequency operation.
申请公布号 US4283837(A) 申请公布日期 1981.08.18
申请号 US19790029424 申请日期 1979.04.12
申请人 U.S. PHILIPS CORPORATION 发明人 SLOB, ARIE
分类号 H01L29/73;H01L21/205;H01L21/28;H01L21/285;H01L21/331;H01L21/768;H01L23/522;H01L23/532;H01L29/08;(IPC1-7):01L21/365;01L21/44;01L21/42 主分类号 H01L29/73
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