| 摘要 |
PURPOSE:To maintain sufficient airtightness in a plasma treating chamber contained in a cavity chamber in the microwave plasma treating apparatus for a long period of time by arranging a cooling air diffuser at a packing inserted between the treating chamber body and a cover plate for cooling the packing. CONSTITUTION:The quartz treating chamber 1 is contained in the cavity chamber 8 having an antenna 9 on a ceiling while an exhaust port 2 and a gas supply port 3 provided at the chamber 1 are projected out of the chamber 8. This chamber 1 is formed of its body and a cover plate 4 for placing the semiconductor wafer 6, and an O-ring packing 5 formed of fluorine rubber is interposed at the contacting part therebetween to be airtight thereat. In this configuration an annular cooling gas diffuser 7 is provided around the peripheral edge of the cover plate 4 and the collar of the body for nipping the packing 5 is also provided. Cooling gas such as N2, Ar or the like is diffused toward the packing 5, thereby cooling the packing 5. Thus, the temperature rise of the packing 5 can be suppressed. |
