| 摘要 |
A honey wafer biscuit comprising an edible wafer top part, an edible wafer bottom part, bees' honey embedded between said bottom and said top part, and edible adhesive at the joints between the said bottom and said top part. Furthermore an apparatus for filling said honey wafer biscuits, which includes means for separating the honey rod, which is supplied to the discharge stations, preferably pneumatically or hydraulically so that the honey rod is cut through in a clean and perfectly satisfactory manner. |
