| 摘要 |
PURPOSE:To reduce the cost, by arranging and fixing respective thin film chips, which are cut and separated from the thin film wafer, on the slider block of a rod material temporarily and by dividing them into individual thin film head cores after the uniting processing course. CONSTITUTION:The thin film wafer where many thin film circuits are formed is cut previously to form many thin film chips 12, and these thin film chips 12 are fixed to positioning face 42a of jig 40 temporarily. Then, slider block 22 formed with nonmagnetic materials is put on positioning face 42b in positioning groove 42 of jig 40 so that the mirror polishing plane of slider block 22 is opposite to thin film chip 12, and the rod material of slider block 22 and thin film chip 12 are melt- stuck to each other by glass. Slider block 22 and thin film chip 12 melt-stuck by glass are removed from jig 40 and are subjected to the lapping processing for magnetic depth determination and is subjected to the track width determination processing by the plasma etching method. Thereafter, the complete separation processing of each thin film head core is performed. |
