| 摘要 |
PURPOSE:To increase the cooling capacity of a boiling cooling device by reducing the gap between the boiling cooling piece of a heat dissipating stack and a container and thereby accelerating the coolant flowing velocity. CONSTITUTION:The cooling piece 3 making contact with a semiconductor element 2 is boiled due to the heat from the element 2 to thus allow the element 2 to be cooled by evaporating latent heat of the piece 3. Vapor thus produced is fed through a tube 8, is cooled by a condenser, and the coolant thus liquified is again circulated and cooled through the tube 9 within an inside container 10. Since the flowing velocity of the vapor and coolant is accelerated when the vapor and coolant are fed through the gap 13 between the container 10 and the cooling piece 3 and boiling heat is transmitted thereto as well as the heat transmission due to the forcible convection thereof is applied thereto, the cooling capacity is increased. Semiconductor stack 2A can be contained in the container 10 to thereby increase the cooling performance of the boiling cooling piece 3 and to reduce the size thereof, and the outer diameter and the inside of the stack 2A as well as the size of the outside container can be reduced respectively. |
