| 摘要 |
PURPOSE:To obtain a thick film hybrid integrated board which is small-sized and is mounted in a high density, by a method wherein a conductor layer and a resistance layer are formed on a ceramic substance, and the work is covered with an insulation layer after it is trimmed so as to be covered within a desired resistance value range. CONSTITUTION:A Ag-Pd system conductor paste is printed on an A2O3 substrate 1 according to a given pattern, and is sintered at 900 deg.C to form a conductor layer 2. A RuO2 system paste, whose sheet resistance is 10, 100, 1K, 10K, and 100KOMEGA/ square, is printed on a section ranging from the substrate exposed between the layers 2 to the end surface of the layer 2, and is sintered at 850 deg.C to form a resistance layer 3. Afterwards, said layer 3 is irradiated with laser light and processed by a sand blast method, and is trimmed so that a resistance value becomes 50% of the initial one. The whole surface of the layer 3 is then covered with an insulation layer 4, and openings are formed so that they are positioned above the layer 2. A conductor layer 5, which contacts the layer 2 and is made of the Ag-Pd system paste, is formed, and openings are formed in the layer 5. A subsequent resistance layer 6, which ranges from a part above the film 4 to the ends of the surface of the layer 5, is then formed. |
