| 摘要 |
PURPOSE: To make adhesion unnecessary, reduce the number of processes and shorten working time without making basic body divided components by forming insulated exterior component integrally out of a substrate and a semiconductor device mounted on this substrate with thermosetting resin disposed surrounding them. CONSTITUTION: A precoat 5 is applied on the whole of a substrate 1 except a connector 3 to protect exposed potions like soldered wiring. An inner cap 12 is put to cover the connector 3 for protection, a plate-shaped upper molding material 6 and a lower molding material 7 are put on upper and lower faces of the substrate 1, and placed at a hollow 101 of a lower molding die 10, and further a supplemental molding material 8 at positions of runners 92 and 102 and a plunger 11. The supplemental molding material 8 is injected into hollows 91 and 101 through the runners 92 and 102 by pushing the plunger 11 down to replenish shortage of the molding materials 6 and 7. By placing the upper and lower molding material 6 and 7 separately on faces of the substrate 1 for molding, the substrate 1 is molded at the central part. Because the substrate is concurrently molded at the central part or prescribed position of the IC card unit, it is not necessary to form basic body with adhesion, number of processes decreases and production cost is reduced. |
