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发明名称
HEATTSENSITIVE ADHESIVE COMPOSITION
摘要
申请公布号
JPS5650981(A)
申请公布日期
1981.05.08
申请号
JP19790127347
申请日期
1979.10.04
申请人
BOSTIK JAPAN
发明人
TOZAKI HIDEO
分类号
C08L27/00;C08L1/00;C08L33/00;C08L33/02;C08L33/04;C08L33/08;C09J133/04
主分类号
C08L27/00
代理机构
代理人
主权项
地址
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