发明名称 SOLDERING MULTIPLEESTAGE PLATE TYPE HEATTEXCHANGER
摘要 PURPOSE:To obtain secure and rigid soldering by placing and melting, while contacting the clearance-keeping projections provided on the upper plate of a heat- exchangers with the small hole parts of the lower plates, solder between fins and the plates. CONSTITUTION:Small holes are provided, in a lower plate 2, at the intervals of the times of an integral number of the corrugation pitches of fins 11 at a place where the contact thereof is made with the clearance-keeping projections 8 provided on an upper plate 1 and the covering thereof is made with the flat part at the underside of the recesses of the fins 11. The holes 9 are made smaller in diameter than the top part 10 of the projections 8. Next, soldering is made in a furnace with foil-shaped solder 21 and 22 placed between the inner walls of the fins 11 and the plates 1 and 2 and the projections 8 contacted with the lower plate 2. Thereby, melted solder 21 and 22 flows into the holes 9 without fail through the capillary action between the flat part 12 of the fins 11 and the plate 2 so that the projections 8 and plate 2 are soldered securely and rigidly.
申请公布号 JPS5646995(A) 申请公布日期 1981.04.28
申请号 JP19790121823 申请日期 1979.09.21
申请人 TSUCHIYA SEISAKUSHO 发明人 MITOMO TAKESHI;YOKO TAKEJI
分类号 F28F3/08;F28F3/04 主分类号 F28F3/08
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