| 摘要 |
PURPOSE:To obtain an electrically and mechanically stabilized bump to be used for wireless bonding by a method wherein a projection electrode of the prescribed thickness and an electrode having a thinner thickness than the prescribed one are provided on the main surface of a semiconductor substrate. CONSTITUTION:The semiconductor substrate 11 is convered by an insulating film 12, an aluminum pad 13 is provided on the film 12 and a metal bump 16 and a conductive material 15 consisted of a surface protective film 14, bonding and reinforcement metal and barrier layer metal are formed on the upper surface of the pad. Also, a conductive substrate 15 alone is formed on the electrode section located on the adjoining semiconductor substrate. Then a lead 17 is contacted to the bump 16, heat and pressure are applied to the upper surface of the contact section and a bonding process is completed. In addition, as to the adjoining semiconductor having a thin electrode, a bonding can be performed easily by having a projection on the lead or by placing solder on the thin electrode. |
