发明名称 PLATING METHOD TO OBTAIN EXTREME THICK FILM IN LOW SPEED HOT DIPPING LINE
摘要 PURPOSE:To make it possible to obtain extremely thick plated film having excellent machinability and resistance to peeling, by hinging one end of a grinding roll, and by revolving the other end in circular arc shape in plating raw material which is previously ground to form a rough surface at the middle part and flat surfaces on both sides. CONSTITUTION:In low speed hot dipping line, a grinding roll, middle part of which is a needle-shaped or edge-shaped rotator, and both ends of which are brushes, is used to roughen the surface. One end of the roll is hinged, and the other end moves in circular arc shape and the roll is rotated. As a result, the surface of the middle part of the breadth of the raw material is roughened in a direction 45 deg. maximum to the longitudinal direction of the raw material, while the surfaces of both sides of the raw material breadth are ground to flatness. Galvanizing the material to desired 600g/m<2> thickness makes possible extreme thick plating with the difference in the deposited quantity of about 100-200g/m<2> between the middle part and the edge part.
申请公布号 JPS5620153(A) 申请公布日期 1981.02.25
申请号 JP19790094247 申请日期 1979.07.26
申请人 NISSHIN STEEL CO LTD 发明人 KURIBAYASHI TAKEO;OONISHI HIROSHI;YAMAMOTO MASARU;TAKEO MANABU
分类号 C23C2/00;C23C2/02 主分类号 C23C2/00
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