| 摘要 |
<p>PURPOSE:To enhance quality of a bonding operation by a method wherein circuits used to oscillate in an X direction and a Y direction are installed in an oscillator, the circuits are turned on simultaneously during the bonding operation and an ultrasonic vibration from both the X direction and the Y direction is exerted on a pad part of a semiconductor device from a capillary. CONSTITUTION:Inputs of amplitude data of an X direction and a Y direction are set in advance in a program inside a bonding apparatus; then, reference oscillation circuits 2, 6 of the X direction and the Y direction are turned on simultaneously; the data are input individually to posterior-stage amplifiers 3, 7. Waveformed of X and Y which have been output from the amplifiers 3, 7 are propagated to a horn 9; an amplitude is transmitted to a posterior capillary 101; an oscillation is started. By this setup, a deposition is expanded uniformly in the X direction and the Y direction in a ring-shaped manner; a difference in die shear strength between the X direction and the Y direction is eliminated.</p> |
