发明名称 Encapsulation casing for electrical component - has main cavity and overflow cavity separated by dividing wall whose height is equal to desired depth of encapsulating medium
摘要 <p>The casing in which an electrical component can be encapsulated comprises a main cavity (45) for receiving the component and the encapsulating medium and a supplementary cavity (46) into which the medium overflows when the main cavity is full. The casing can be square or cylindrical with an inner wall dividing the two cavities, the wall being of a lower height than the casing main walls. In a preferred form the casing is cylindrical with the main cavity formed by an insert (48) having radial flanges (44,43) to seat the insert centrally of the casing leaving a space to form the supplementary cavity (46). Holes (47) in the insert upper wall allow overflow of medium. Different inserts can be used for different volume components, the overflow allowing a fixed level at encapsulating medium.</p>
申请公布号 FR2462083(A1) 申请公布日期 1981.02.06
申请号 FR19790018812 申请日期 1979.07.20
申请人 LCC CICE CIE EUROP COMPO ELECTRO 发明人 DANIEL BERNARD
分类号 H05K13/00;(IPC1-7):05K5/04 主分类号 H05K13/00
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