| 摘要 |
PURPOSE:To simplify the package constitution by securing the airtight sealing of the sealing cover onto the sigle surface of the piezoelectric substrate by the sound absorbing material layer and the adhesive layer. CONSTITUTION:Elastic surface wave oscillator 2 and receiving electrode 3 are formed on piezoelectric substrate 1, along with shielding electrode 8 and the lead-out parts of these electrodes when necessary. Then sound absorbing material layer A and airtight sealing adhesive layer 9 are formed at the outer edge of the electrode pattern. Thus the airtight adhesion is secured for the sealing cover by these two layers. As a result, the supporting substrate can be eliminated. In addition, the package can be constituted with the minimum necessary amount of the component parts and materials by using the sound absorbing material in common with the adhesive that is used to fix the sealing cover. |
