Carrier materials impregnated with thermosetting resins, process for their manufacture and their use

摘要

Described herein is a resin-cured carrier material and a process for preparing a resin-cured carrier material. The carrier material has two oppositely disposed major surfaces and a core therebetween, the core being impregnated with at least one heat-cured thermosetting resin and at least one of the two surfaces having a coating of at least one polymerization resin curable by U.V.-radiation, electron radiation or the radiation of radio-active isotopes.