发明名称 PLURAL LAYER NONNELECTROLYTIC PLATING
摘要 PURPOSE:To easily provide economical electric conductivity to a complex shape waveguide by forming sequentially plural non-electrolytic Ni, Cu, Ag, and Au plating layers in specific thickness on substrate such as metal. CONSTITUTION:A complex shape waveguide substrate 1 which is too difficult for electrolytic plating to be applied is plated with plural, sequential layers of non-electrolytic Ni 2, Cu 3, Ag 4, and Au 5 in specified thickness, so that electric conductivity is given by the Ag 4 and Au 5 layers. This easily improves the electric property of plated layer in a waveguide used, for example, in millimeter wavelength range which, used to be allegedly difficult.
申请公布号 JPS56269(A) 申请公布日期 1981.01.06
申请号 JP19790074166 申请日期 1979.06.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAKURA YOSHINORI
分类号 H01P11/00;C23C18/44;C23C18/52 主分类号 H01P11/00
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