| 摘要 |
<p>PURPOSE:To make possible a significant reduction in manhour, an increase in a fine processing and a low cost by a method wherein the assembly and sealing of pellet, which have been performed by individual packages, are disposed simultaneously by a multitude of packages. CONSTITUTION:Electrodes are formed on the surface of a ceramic sheet 1 with penetrated holes bored therein along scribing lines by such a means as printing or deposition. A second green sheet 3 with a plurality of element housing windows 7 bored therein is prepared. The sheet 3 is superposed on the sheet 1 to sinter integrally and a multilayer ceramic sheet is formed. The electrode side of IC pellets 4 is faced downward and a face down bonding is performed on the electrodes 2 on the sheet 1.A cap sheet 5 is superposed and bonded on the sheet through a glass or the like. The 3-layer ceramic sheet is cut by laser scribing conforming to scribing lines and is separated into individual products, each including an IC. Thereby, a significant reduction in manhour, an increase in a fine processing and a low cost become possible.</p> |
