| 摘要 |
PURPOSE:To form the bonding layer to desired thickness and to make broad the band for the delay line, by providing a spacer between the bonding layer at the piezoelectric converter and that at the delay line and controlling the thickness of the spacer. CONSTITUTION:Low melting point metals 6, 6' such as solder are placed on the delay line medium 5, spacers 7, 7' such as lead and tin are overlaid on it, low melting point metals 8, 8' are placed on it, and piezoelectric converters 4, 4' are laminated further on it. Next, heating is made at the temperature more than the melting point of the low melting point metals 6, 6' and 8, 8' and less than the spacers 7, 7'. After that, required weight is pressed, which can eliminate air bubbles and lamination is finished with cooling. In this case, the thickness of the spacers 7, 7' is determined so that the thickness of the total bonding layer laminated can be 1/4lambda. Thus, the thickness of the spacers are controlled and the thickness of laminated layers can be 1/4lambda to the extent that the air bubbles can not give any affect to the characteristics of delay line. Accordingly, the band of delay line can be made broader. |
