| 摘要 |
PROBLEM TO BE SOLVED: To surely distinguish (questionable) defects impeding the functional performance of chips from (unquestionable) defects not impeding the functional performance in a method of assessing the defects of a patterned wafer. SOLUTION: Just detected surface information of individual image fields (4) on the wafer surface is compared with previously detected surface information from many wafers surfaces having the same structure in the same manufacturing process, i.e., reference information prepared and electronically stored, based on the surface information of the individual image fields (4) in the same place.
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