摘要 |
PURPOSE:To provide title compsn. which improve curing characteristics at high temp. and high humidity, can prolong pot life and is useful as building sealing medium, consisting of polydiorganosiloxane, organosilicon cpd. contg. specified gp., fine CaCO3 powder and fine wet-process silica powder. CONSTITUTION:There are provided room-temperature curing polyorganosiloxane compsn. consisting of (A) 100pts.wt. of hydroxyl-terminated polydiorganosilixane having a viscosity (at 25 deg.C) of 20-1,000,000 CP, (B) 0.5-15pts.wt. of organosilicon cpd. having at least two organoaminoxy gp. per molecule, (C) 10- 200pts.wt. of fine CaCO3 powder and (D) 0.1-30ptw.wt. of fine wet-process silica powder. Examples of (A) are cpd. of formula I (wherein R<1> is substd. or unsubstituted hydrocarbon, pref. methyl; n is a value at which viscosity at 25 deg.C is 20- 1,000,000 CP). Examples of (B) are cpd. of formula II or III or a mixt. Thereof. preferable org. gp. which is bonded to aminoxy gp. of (B) is ethyl gp. |