发明名称 ROOMMTEMPERATURE CURING POLYORGANOSILOXANE COMPOSITION
摘要 PURPOSE:To provide title compsn. which improve curing characteristics at high temp. and high humidity, can prolong pot life and is useful as building sealing medium, consisting of polydiorganosiloxane, organosilicon cpd. contg. specified gp., fine CaCO3 powder and fine wet-process silica powder. CONSTITUTION:There are provided room-temperature curing polyorganosiloxane compsn. consisting of (A) 100pts.wt. of hydroxyl-terminated polydiorganosilixane having a viscosity (at 25 deg.C) of 20-1,000,000 CP, (B) 0.5-15pts.wt. of organosilicon cpd. having at least two organoaminoxy gp. per molecule, (C) 10- 200pts.wt. of fine CaCO3 powder and (D) 0.1-30ptw.wt. of fine wet-process silica powder. Examples of (A) are cpd. of formula I (wherein R<1> is substd. or unsubstituted hydrocarbon, pref. methyl; n is a value at which viscosity at 25 deg.C is 20- 1,000,000 CP). Examples of (B) are cpd. of formula II or III or a mixt. Thereof. preferable org. gp. which is bonded to aminoxy gp. of (B) is ethyl gp.
申请公布号 JPS55147550(A) 申请公布日期 1980.11.17
申请号 JP19790055456 申请日期 1979.05.07
申请人 TOSHIBA SILICONE 发明人 ENDOU ISAO;KUNIYA JIYOUJI;SHINOHARA KAZUTO
分类号 C08L83/00;C08K13/02;C08L83/04;C08L83/06 主分类号 C08L83/00
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