| 摘要 |
PURPOSE:To provide a package having high reliability, thin shape, and lead terminals reduced in size by forming lead electrodes connected to the electrode terminals of an external circuit from electrode terminals of an IC, an LSI or the like by a plating method. CONSTITUTION:The first opening 2 is formed at a resin film 1, the first metal film 3 is adhered onto the film 1, and the second openings 6 are formed in the vicinity of the electrode terminals 5 of a semiconductor element 4 at the film 3. Then, adhesive thermost resin 7 is coated on the surface of the element 4, the openings 6 are positioned with the electrode terminals 5 to thermally press the film 3 onto the element 4, and the exposed resin 7 of the openings 6 is opened to expose the terminals 5. Then, the second metal film 8 is vacuum evaporated thereon, photosensitive resin film 9 is coated on the film 8, and a rectangular pattern 9 extended to the film 1 including the openings 6' in the vicinity of the terminals 5 is photoetched. After the third metal film 10 is plated on the exposed surface of the film 8 of the pattern 9', the resin film 9 and the metal films 3, 8 are etched and removed to form electrode leads from the metal film 10. |
