| 摘要 |
PURPOSE:To enable flux to be coated evenly on the object to be soldered by converting and diffusing liquid-form flux to mist-form and disposing the object to be soldered such as printed wiring substrate in the passage where this mist is sucked. CONSTITUTION:Liquid-form flux 2 is led into the flux passage 12 in an ultrasonic oscillator 4 and air is sent into an air channel 7. The liquid-form flux 2 is pulverized by the vibrations of the atomizing surface 13 by the ultrasonic oscillator 4 and passes through the air channel 7 as mist-form flux 14. This flux spouts out from a diffusion port 15. The mist-form flux 14 is drawn through a suction port 18 by the air suction by a rotary impeller 20. On this way, the mist-form flux 14 evenly deposits on the surface 23 and the surface, etc. of lead terminals 24 of a printed wiring substrate 22 being the object to be soldered. The remaining mist-form flux 25 is sucked into the suction port 18 and is recovered as lqiuid-form. The sucked air is exhausted through an air exhaust port 26. |
