| 摘要 |
PURPOSE:To cut a work, such as a silicon wafer, by a dry type grinding wheel by blowing an inert gas against the work at the cutting position. CONSTITUTION:Cooled and vaporized nitrogne gas is blown through a nozzle 6 against the cutting position. The jet of nitrogen gas eliminates oxygen and cools the working cutting edge of the griding wheel 3 and the silicon wafer 1 at the cutting position so that the silicon wafer 1 is cut by the grinding wheel 3 in the dry state. The cutting device of this dry type cutting method is applicable to a variety of cutting purposes and capable of severing works having considerable thickness. |
