发明名称 COOLING STRUCTURE FOR ELECTRONIC DEVICE
摘要 PURPOSE:To equalize a temperature distribution in a rack, and also, to realize a low noise by controlling separately the number of revolution of a cooling fan for cooling an electronic circuit package by a temperature in the upper part of an area cooled by its fan. CONSTITUTION:In an area for cooling a high power consumption electronic circuit package group 1, a temperature sensor 6 provided on the upper part instructs a high temperature, therefore, the number of revolution of a variable wind speed fan 4 is operated in a high speed state so as to be stabilized at a set temperature. On the other hand, in an area for cooling an electronic circuit package group 2 of normal power, the temperature sensor provided on the upper part instructs a low temperature, therefore, the number of revolution of the variable wind speed fan 4 is operated in a low speed state so as to be stabilized at a set temperature. In such a way, a temperature distribution in a rack can be held uniformly. Also, other part than the high power consumption electronic circuit package circuit is cooled by the fan of a low speed rotation, therefore, a noise generated from the device can be lowered.
申请公布号 JPH01197816(A) 申请公布日期 1989.08.09
申请号 JP19880023178 申请日期 1988.02.02
申请人 NEC CORP 发明人 NISHI YASUO
分类号 G06F1/20;G05D23/00;G05D23/19;G06F1/00;H01L23/46;H01L23/467;H05K7/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址