| 摘要 |
PURPOSE:To keep the press-bonded area for wire and semiconductor element constant by controlling a deformation of the wire at the time of bonding to come in a given space provided at the tip of a capillary. CONSTITUTION:A gold ball 5 formed on one end of a gold wire 1 with oxyhydrogen flame is moved by a capillary 12 having a conical 10 space provided with a relief on its tip and press-bonded thermally to the top of a pellet 4. In any gold ball of an arbitrary size, in this case, an area of the press-bonded zone 14 of the gold ball and the pellet depends only upon the conical zone 10 in the capillary and it kept constant at all times as the gold deformed in surplus is moved to the relief 15 in the capillary. According to this method, a dispersion in size of the press-bonded ball is eliminated, and further the gold wire can be bonded in a small area regardless of its size. |
