| 摘要 |
A hybrid solid state package in which integrated circuits, precision resistor networks, capacitors and their interconnections are accommodated on a multi-layer process substrate while thick film resistors and interconnections provided on a separate substrate, which sub-assemblies are then sandwiched together using film epoxies are inserted within a single package, to thereby yield a structure of significantly smaller size and lighter weight and having minimal number of input-output interconnections as compared with conventional designs and without impairing quality or reliability.
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