发明名称 SPUTTERING UNIT
摘要 PURPOSE:To form metal film of uniform thickness on the surface of a substrate, by using a cylindrical magnet type sputtering unit provided with plural permanent magnets in the cathode thereof to form plural sputtering sources. CONSTITUTION:A target 4, an anode 5, a substrate 6 are arranged coaxially in a cylindrical vacuum vessel 3. The target 4 is adhered by spraying target material 4' such as Cr to the outer periphery of a cylinder 8 which is made of nonmagnetic material and is attached to the center section of the base through an insulating material 7. In the cylinder 8 are arranged plural hollow, circular plate-shaped permanent magnets 9 coaxially so that the direction of the magnetic field intersects at right angles the direction of the electric field between both the electrodes 4, 5. A glow discharge is produced between the electrodes 4, 5 to generate cathode sputering so that the target atoms are adhered and built up on the substrate 6. The density of the target metal atoms sputtered in the space between the electrodes is uniformized because of the plural magnets 9, and a metal film formed on the surface of the substrate 6 shows uniform thickness.
申请公布号 JPS5562164(A) 申请公布日期 1980.05.10
申请号 JP19790125344 申请日期 1979.10.01
申请人 TOKUDA SEISAKUSHO 发明人 ITOU YOSHINORI;KURIYAMA NOBORU
分类号 C23C14/34;C23C14/35;C23C14/36;H01J37/34 主分类号 C23C14/34
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