| 摘要 |
PURPOSE:To directly attach a Si pellet, by annealing the whole lead frame, which is manufactured by integrally forming a lead thin portion and a header thick portion and consists of non-oxygen copper containing tin or iron, and by hardening a surface of the thick portion by plastically working the thick portion selectively. CONSTITUTION:A special form copper strip, which main component is non-oxygen copper containing Sn or Fe and is produced by integrally making up a lead 2 of a thin portion and a header 1 of a thick portion, is used as a lead frame material. The copper strip, for example, is annealed at 450 deg.C for three minutes, the whole material is bent and the material is brought to hardness appropriate for working. The hardness of a surface of the thick portion of the header 1 is increased by plastically working the thick portion selectively by pressurizing only the thick portion by means of a pressurizing bar 7, etc. Thus, bending working is easy and the lead is not broken bacause the lead portion is annealed, and a Si pellet of a power IC, a power transistor, etc. be directly can mounted because the hardness of the header portion is increased. |
