| 摘要 |
PURPOSE:To improve bonding efficiency, by inserting a waveform detector element into a transmitter side input terminal of a supersonic wedge, and detecting a wire cut by the waveform detected at the time of bonding. CONSTITUTION:By using support 1, supersonic horn 3 screwed with a supersonic wedge 6 on its end is supported on one side, and oscillator 2 is supported on the other side. Next, oscillator 2 is connected with transmitter 4, and synchroscope 5 is connected to the wiring connecting these elements. When supersonic wire bonding is operated under this structure, the monitor waveform appearing on synchroscope 5 differs between a normal and an abnormal case. Hence, this is converted into a binary digital waveform, and by observing this, a wire cut is ascertained. In this way, a wire-cut detector device is fitted to a bonder device itself. |
