发明名称 FRICTION PLATING APPARATUS
摘要 PURPOSE:To provide a friction plating apparatus which makes it possible to perform the friction plating of wire material simply and rapidly without causing environmental pollution, snd is constituted so as to make metal powder, carbon adere to the surface of the wire material to be treated, and to draw the material by means of a die. CONSTITUTION:Wire material, e.g., wire, wire-shaped material, pipe, which is set to as to be freely drawably between a swift and a coiling drum, is pretreated, e.g., degreased, activated, and washed with water, it is then transferred to a flux step, where its surface is treated with a flux (e.g., hydrochloric acid). To the surface of the wire material are adhered uniformly metal powder, metallic paint, carbon, or metallic oxides etc., by coating or spraying. Thereafter, the wire material is caliber rolled to strengthen the adherence, and heat-treated at a temp. at which the metal powder hardly melts. After the heat treatment, the wire material is drawn by means of a die to press the metal powder etc. to the wire, and is heated as a post-treatment step, so that the scales formed during heat treatment and impurities formed during drawing by means of a die are removed, completing the friction plating.
申请公布号 JPS5531177(A) 申请公布日期 1980.03.05
申请号 JP19780104574 申请日期 1978.08.28
申请人 MISHIMA KOSAN CO LTD 发明人 TOMONO RIHEI;ICHIOKA SATOSHI;TSUZAWA TAKASHI
分类号 C23C10/30;C23C4/18;C23C24/06;C23C26/00 主分类号 C23C10/30
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