| 摘要 |
PURPOSE:To obtain semiconductor pellets without damaging the inclined surface irrespective of the crystal orientation of the wafer by using the dicing saw having the taper form with a flat head in cross section, when dividing the semiconductor wafer into multiple pellets through a dicing. CONSTITUTION:A wafer 11 including multiple semiconductor elements is secured on a supporter 12 made of a quartz plate with the aid of wax and the like. A corrosion resisting cover 13 such as light wax is coated on the exposed surface of the wafer. Then, the wafer 11 is cut down by use of a dicing saw 14 having the taper form with a flat head in cross section almost therethrough form above of the cover 13 so as to separate each element 11a from each other by grooves 15 in the form of trapezoid. In such a manner, inclined surfaces 16 are formed at the sides of each element 11a corresponding to the inclined angle of a taper portion 14a of the saw 14. Finally, machined distorsion layers 18 produced on the inclined surfaces and flat surfaces 17 at the bottom of grooves 15 are removed through an etching by use of hydro fluoric acidnitric acid solution. |
