发明名称 METHOD OF FORMING PARTIAL NICKEL LAYER
摘要 PURPOSE:To form a nickel layer of predetermined thickness at required portion of an article to be plated by plating first copper plated layer and nickel electroplated layer thereon on the entire surface and plating second copper plated layer on the predetermined portion as a mask to thereby remove the exposed copper layer on the exposed nickel layer. CONSTITUTION:A nickel striken plated layer 45 is formed, for example, on the entire surface of an Fe-Cr alloy wire 40. Then, the first copper plated layer 46 of 10-15mu of thickness is formed on the entire upper surface of the layer 45. A nickel electroplated layer 47 of 8-10mu of thickness is formed on the entire upper surface of the layer 46. Then, the second copper plated layers 48, 48 of 1-3mu of thickness are coated on the predetermined portion on the layer 47. It is then dipped in alkaline solution of aromatic nitro compound containing amine compound to thereby selectively remove the exposed nickel plated layer 47. Then, it is dipped in an ammonia alkaline oxidizer solution to thereby remove the second copper plated layers 48, 48 and exposed the first copper plated layer 46. Then, it is removed from the exposed nickel layer 45 with acid, and treated selectively with Cr oxidation treatment.
申请公布号 JPS5521536(A) 申请公布日期 1980.02.15
申请号 JP19780093487 申请日期 1978.07.31
申请人 NIPPON ELECTRIC CO 发明人 OKADA JIYUNICHI
分类号 H01R11/11;C23F1/00;C25D5/02;H01R11/00 主分类号 H01R11/11
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