| 摘要 |
PURPOSE:To decrease wiring density without providing extra through holes or via holes in a board, by providing a circuit between a bonding part and a chip mounting part, forming interconnections between the bonding pad and other conductor parts, and applying an insulating coating on the circuit. CONSTITUTION:Interconnecting relation is determined for a bonding pad 6 on a wire bonding board. A pattern wiring between the bonding pad 6 and other conductor parts F such as through holes and a chip pad 53 is formed. At this time, a circuit 30 is formed between a bonding pad part 10 and a chip mounting part 20. At this time, the circuit 30 is insulated and coated so that short circuits are not formed even if wires between a chip 52 and a bonding pad 7 are lowered and sufficient electrical functions can be accomplished. In this way, interconnections between the required bonding pad 7 and the conductor parts A-H can be formed at a low density without providing extra through holes or via holes. |
