Semiconductor device with insulating layer on substrate - has printed wiring with additional metallic lead on power supply bus=bars

摘要

A semiconductor device is used which consists of a substrate with circuit elements on parts of the surface. The surface is covered with an insulating layer with holes to expose sections of the circuits. The printed wiring (4) is used to link circuit elements and incorporates a power supply line (2). There is an additional metallic lead (3) which for the main part coincides with the power supply lead. It is narrower than the power supply lead (2). It is applied by a precipitation process.