| 摘要 |
A wafer depositing apparatus for fabricating a semiconductor is provided to prevent reaction gas from being deposited on an open/shut door by flowing inert gas between the inlet/outlet of a process chamber and the open/shut door. An inlet/outlet(120) into and from which a wafer is loaded/unloaded is formed in a process chamber(110). The inlet/outlet of the process chamber is opened/shut by an open/shut door(130). A block unit(200) forms inert gas flow for separating the process chamber from the open/shut door to prevent the reaction gas of the process chamber from being deposited on the open/shut door, formed in the inlet/outlet. The inert gas can be selected from an inert gas group of N, Ne, Ar, Kr, Xe and Rn.
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