| 摘要 |
<p>PURPOSE:To make it possible to divide a semiconductor into pellets efficiently and also to reduce defects such as cracking of a semiconductor by sequentially carrying out the scribing and cracking of a wafer on the same table. CONSTITUTION:Semiconductor wafer 1 with formed elements is placed on table 2 and then fixed hard by vacuum-suction. In this case, the wafer is so mounted that boundary lines of each element will agree with lines kof longitudinal and lateral V grooves 9 of the table. Next, scribing grooves 5 are formed along boundary lines of respective elements. That results in the agreement between scribing grooves 5 and V grooves 9. Next, high-pressure air is jetted out from air jet aperture 10 momently with the wafer fixed onto the table. In this case, impulsive force P1 of the high-pressure air is applied upward to the corresponding part of the scribing groove and vacuum adsorption force P2 is also applied downward to the wafer at the intermediate part. In consequence, the wafer is divided, under the influence of scribing, at weak parts with a strain layer and then separated momently into pellets bounded at scribing grooves.</p> |
