| 摘要 |
PURPOSE:To enable the successive photoelectron transfer of each region of a pattern by only aligning a mask and a wafer even if a photoelectron transfer apparatus having an electrode plate with a slit is used, by equipping a specific operation unit and a specific electric/magnetic field controller and other units. CONSTITUTION:This apparatus includes an operation unit 13 to detect the relative positions of first and second matching patterns on a photoelectron transfer mask 2 having a pattern emitting a light received from a light source 1 and corresponding first and second matching patterns on a wafer 8, perform an operation of the first exposure conditions of the first matching pattern and the second exposure conditions of the second matching pattern, and when exposing the area corresponding to a slit to a light while changing the relative positions of the photoelectron transfer mask 2 and a wafer supporter 6, and an electrode plate with the slit 3, to find the exposure conditions of the exposed part from the relative distances between the exposed part and the first and the second matching patterns and from the first and the second exposure conditions, and an electric/magnetic field controller 7 to correct an electron based on the result sent from the operation unit 13. |
